Many materials and products have temperature-dependent characteristics; this makes analysing the impact of heat and ensuring thermal management of structures and fluids crucial in product development.

The C2-THERMION is cloud-based simulation software platform allows you to predict the airflow, temperature distribution, and heat transfer. Use C2-THERMION’s thermal simulation as a heat transfer simulator to analyse and optimize your product early in the design phase.

C2-THERMION’s thermal simulation software component enables you to perform both thermomechanical and heat transfer analyses. The thermal analysis software takes into account the energy balance of the system. When investigating thermomechanical components, the effects of thermal loads on solids can also be included. For many industrial applications, simulating the stress response to thermal loads and understanding failure is essential. Applications include polymeric materials, valves, pipes, basket strainers, PCB, pressure vessels and more. Conduction refers to a heat transfer between substances that are in direct contact with each other. In theory, heat energy passes from the hot to the cold end of the substance and is directly related to the conductivity of the material. The C2-THERMION thermal simulation software offers a module for various types of applications where heat and energy are significant study parameters. You can simulate conduction between different materials and can also model temperature-dependent conductivity. Examples include car brakes, heat sinks, aluminium casing, worm gearboxes, and more.

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